FDG6306P vs FDG6317NZ

This in-depth comparison of the FDG6306P and FDG6317NZ provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDG6306P

onsemi

Lifecycle: Active
Stock: 20835 PCS
Package: SC-88
Series: Transistors - FETs, MOSFETs - Arrays

+BOM RFQ

Part B

FDG6317NZ

onsemi

Lifecycle: Active
Stock: 15868 PCS
Package: SC-88
Series: Transistors - FETs, MOSFETs - Arrays

+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDG6306P	FDG6317NZ
Supplier	onsemi,Rochester Electronics, LLC	onsemi
Series	PowerTrench®	PowerTrench®
Part Status	Active	Active
FET Type	2 P-Channel (Dual)	2 N-Channel (Dual)
FET Feature	Logic Level Gate	Logic Level Gate
Drain to Source Voltage (Vdss)	20V	20V
Current - Continuous Drain(Id) @ 25°C	600mA	700mA
Rds On(Max) @ Id Vgs	420mOhm @ 600mA, 4.5V	400mOhm @ 700mA, 4.5V
Vgs(th)(Max) @ Id	1.5V @ 250µA	1.5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	2nC @ 4.5V	1.1nC @ 4.5V
Input Capacitance(Ciss)(Max) @ Vds	114pF @ 10V	66.5pF @ 10V
Power - Max	300mW	300mW
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount

Compare RFQ