FDMS86500L vs FDMS8050ET30

This in-depth comparison of the FDMS86500L and FDMS8050ET30 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDMS86500L

onsemi

Lifecycle: Active
Stock: 3874 PCS
Package: TDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

Part B

FDMS8050ET30

onsemi

Lifecycle: Active
Stock: 4401 PCS
Package: TDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDMS86500L	FDMS8050ET30
Series	PowerTrench®	PowerTrench®
Part Status	Active	Not For New Designs
FET Type	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	60 V	30 V
Current - Continuous Drain(Id) @ 25°C	25A (Ta), 80A (Tc)	55A (Ta), 423A (Tc)
Drive Voltage(Max Rds On Min Rds On)	4.5V, 10V	4.5V, 10V
Rds On(Max) @ Id Vgs	2.5mOhm @ 25A, 10V	0.65mOhm @ 55A, 10V
Vgs(th)(Max) @ Id	3V @ 250µA	3V @ 750µA
Gate Charge(Qg)(Max) @ Vgs	165 nC @ 10 V	285 nC @ 10 V
Vgs(Max)	±20V	±20V
Input Capacitance(Ciss)(Max) @ Vds	12530 pF @ 30 V	22610 pF @ 15 V
Power Dissipation (Max)	2.5W (Ta), 104W (Tc)	3.3W (Ta), 180W (Tc)
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 175°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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