FDV301N vs FDV302P

This in-depth comparison of the FDV302P and FDV301N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
FDV302P

+BOM

5215 PCS | onsemi
FDV301N

+BOM

4978 PCS | onsemi
Package SOT23-3
Description MOSFET P-CH 25V 120MA SOT23 MOSFET N-CH 25V 220MA SOT23
Part Status Obsolete -
Base Product Number FDV30 -
FET Type P-Channel -
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 25 V -
Current - Continuous Drain (Id) @ 25°C 120mA (Ta) -
Drive Voltage (Max Rds On, Min Rds On) 2.7V, 4.5V -
Rds On (Max) @ Id, Vgs 10Ohm @ 200mA, 4.5V -
Vgs(th) (Max) @ Id 1.5V @ 250µA -
Gate Charge (Qg) (Max) @ Vgs 0.31 nC @ 4.5 V -
Vgs (Max) -8V -
Input Capacitance (Ciss) (Max) @ Vds 11 pF @ 10 V -
Power Dissipation (Max) 350mW (Ta) -
Operating Temperature -55°C ~ 150°C (TJ) -
Mounting Type Surface Mount -
Packaging Tape & Reel (TR) -
ProductStatus - Active
FETType - N-Channel
DraintoSourceVoltage(Vdss) - 25 V
Current-ContinuousDrain(Id)@25°C - 220mA (Ta)
DriveVoltage(MaxRdsOnMinRdsOn) - 2.7V, 4.5V
RdsOn(Max)@IdVgs - 4Ohm @ 400mA, 4.5V
Vgs(th)(Max)@Id - 1.06V @ 250µA
GateCharge(Qg)(Max)@Vgs - 0.7 nC @ 4.5 V
Vgs(Max) - ±8V
InputCapacitance(Ciss)(Max)@Vds - 9.5 pF @ 10 V
PowerDissipation(Max) - 350mW (Ta)
OperatingTemperature - -55°C ~ 150°C (TJ)
MountingType - Surface Mount
Comparison Model : FDV302P FDV301N

+BOM RFQ