GD25Q32CSIG vs GD25Q64CSIGR

This in-depth comparison of the GD25Q32CSIG and GD25Q64CSIGR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

GD25Q32CSIG

GigaDevice Semiconductor (HK) Limited

Lifecycle: Active
Stock: 3574 PCS
Package: SOP-8
Series: Memory

+BOM RFQ

Part B

GD25Q64CSIGR

GigaDevice Semiconductor (HK) Limited

Lifecycle: Active
Stock: 6900 PCS
Package: SOP-8
Series: Memory

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	GD25Q32CSIG	GD25Q64CSIGR
Part Status	Not For New Designs	Not For New Designs
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	32Mb (4M x 8)	64Mb (8M x 8)
Memory Interface	SPI - Quad I/O	SPI - Quad I/O
Clock Frequency	120 MHz	120 MHz
Write Cycle Time - Word Page	50µs, 2.4ms	50µs, 2.4ms
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount

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