GD25Q64ESIGR vs GD25Q64CSIGR

This in-depth comparison of the GD25Q64ESIGR and GD25Q64CSIGR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

GD25Q64ESIGR

GigaDevice Semiconductor (HK) Limited

Lifecycle: Active
Stock: 5012 PCS
Package: SOP-8
Series: Memory

+BOM RFQ

Part B

GD25Q64CSIGR

GigaDevice Semiconductor (HK) Limited

Lifecycle: Active
Stock: 6900 PCS
Package: SOP-8
Series: Memory

+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	GD25Q64ESIGR	GD25Q64CSIGR
Part Status	Active	Not For New Designs
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	64Mb (8M x 8)	64Mb (8M x 8)
Memory Interface	SPI - Quad I/O	SPI - Quad I/O
Clock Frequency	133 MHz	120 MHz
Write Cycle Time - Word Page	70µs, 2.4ms	50µs, 2.4ms
Access Time	7 ns	-
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount

Compare RFQ