GD25VQ40CEIGR vs GD25VQ80CEIGR

This in-depth comparison of the GD25VQ40CEIGR and GD25VQ80CEIGR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

GD25VQ40CEIGR

GigaDevice Semiconductor (HK) Limited

Lifecycle
Active
Stock
7934 PCS
Package
XFDFN-8
Series
Memory
+BOM RFQ
Part B

GD25VQ80CEIGR

GigaDevice Semiconductor (HK) Limited

Lifecycle
Active
Stock
5901 PCS
Package
XFDFN-8
Series
Memory
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification GD25VQ40CEIGR GD25VQ80CEIGR
Part Status Active Discontinued at Digi-Key
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NOR FLASH - NOR
Memory Size 4Mb (512K x 8) 8Mb (1M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O
Clock Frequency 104 MHz 104 MHz
Write Cycle Time - Word Page 50µs, 3ms 50µs, 3ms
Voltage - Supply 2.3V ~ 3.6V 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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