HD64F2357F20V vs HD64F3644DV

This in-depth comparison of the HD64F2357F20V and HD64F3644DV provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

HD64F2357F20V

Renesas Electronics America Inc

Lifecycle
Active
Stock
6998 PCS
Package
QFP-128
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

HD64F3644DV

Renesas Electronics America Inc

Lifecycle
Active
Stock
4136 PCS
Package
QFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification HD64F2357F20V HD64F3644DV
Supplier - Flip Electronics,Renesas Electronics America Inc
Series H8® H8S/2300 H8® H8/300L
Part Status Obsolete Obsolete
Core Processor H8S/2000 H8/300L
Core Size 16-Bit 8-Bit
Speed 20MHz 8MHz
Connectivity SCI, SmartCard SCI
Peripherals DMA, POR, PWM, WDT PWM, WDT
Number of I/O 87 53
Program Memory Size 128KB (128K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 8K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x8b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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