HD64F3687HV vs HD64F3644DV

This in-depth comparison of the HD64F3687HV and HD64F3644DV provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

HD64F3687HV

Renesas Electronics America Inc

Lifecycle
Active
Stock
3173 PCS
Package
QFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

HD64F3644DV

Renesas Electronics America Inc

Lifecycle
Active
Stock
4136 PCS
Package
QFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification HD64F3687HV HD64F3644DV
Supplier - Flip Electronics,Renesas Electronics America Inc
Series H8® H8/300H Tiny H8® H8/300L
Part Status Active Obsolete
Core Processor H8/300H H8/300L
Core Size 16-Bit 8-Bit
Speed 20MHz 8MHz
Connectivity I²C, SCI SCI
Peripherals PWM, WDT PWM, WDT
Number of I/O 45 53
Program Memory Size 56KB (56K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 4K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 8x10b A/D 8x8b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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