HD64F3062BFBL25V vs HD64F7045F28V

This in-depth comparison of the HD64F3062BFBL25V and HD64F7045F28V provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

HD64F3062BFBL25V

Renesas Electronics America Inc

Lifecycle
Active
Stock
2484 PCS
Package
QFP-100
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

HD64F7045F28V

Renesas Electronics America Inc

Lifecycle
Active
Stock
3205 PCS
Package
FQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification HD64F3062BFBL25V HD64F7045F28V
Series H8® H8/300H SuperH® SH7040
Part Status Obsolete Obsolete
Core Processor H8/300H SH-2
Core Size 16-Bit 32-Bit Single-Core
Speed 25MHz 28.7MHz
Connectivity SCI, SmartCard EBI/EMI, SCI
Peripherals DMA, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 70 98
Program Memory Size 128KB (128K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount
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