HD64F3672FXV vs HD64F7144F50V

This in-depth comparison of the HD64F3672FXV and HD64F7144F50V provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

HD64F3672FXV

Renesas Electronics America Inc

Lifecycle
Active
Stock
5055 PCS
Package
QFP-48
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

HD64F7144F50V

Renesas Electronics America Inc

Lifecycle
Active
Stock
1829 PCS
Package
QFP-112
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification HD64F3672FXV HD64F7144F50V
Series H8® H8/300H Tiny SuperH® SH7144
Part Status Active Active
Core Processor H8/300H SH-2
Core Size 16-Bit 32-Bit Single-Core
Speed 16MHz 50MHz
Connectivity SCI EBI/EMI, I²C, SCI
Peripherals PWM, WDT DMA, POR, PWM, WDT
Number of I/O 26 74
Program Memory Size 16KB (16K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 3.6V
Data Converters A/D 4x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount
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