IRF7342PBF vs IRF7306TR

This in-depth comparison of the IRF7342PBF and IRF7306TR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

IRF7342PBF

Infineon Technologies

Lifecycle
Active
Stock
2889 PCS
Package
SOIC-8
Series
Transistors - FETs, MOSFETs - Arrays
+BOM RFQ
Part B

IRF7306TR

Infineon Technologies

Lifecycle
Active
Stock
9561 PCS
Package
SOIC-8
Series
Transistors - FETs, MOSFETs - Arrays
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification IRF7342PBF IRF7306TR
Supplier - Infineon Technologies
Series HEXFET® HEXFET®
Part Status Discontinued at Digi-Key Obsolete
FET Type 2 P-Channel (Dual) 2 P-Channel (Dual)
FET Feature Logic Level Gate Logic Level Gate
Drain to Source Voltage (Vdss) 55V 30V
Current - Continuous Drain(Id) @ 25°C 3.4A 3.6A
Rds On(Max) @ Id Vgs 105mOhm @ 3.4A, 10V 100mOhm @ 1.8A, 10V
Vgs(th)(Max) @ Id 1V @ 250µA 1V @ 250µA
Gate Charge(Qg)(Max) @ Vgs 38nC @ 10V 25nC @ 10V
Input Capacitance(Ciss)(Max) @ Vds 690pF @ 25V 440pF @ 25V
Power - Max 2W 2W
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Compare RFQ