IRFB4110PBF vs IRFB4227PBF

This in-depth comparison of the IRFB4110PBF and IRFB4227PBF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

IRFB4110PBF

Infineon Technologies

Lifecycle: Active
Stock: 7679 PCS
Package: TO-220
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

Part B

IRFB4227PBF

Infineon Technologies

Lifecycle: Active
Stock: 3207 PCS
Package: TO-220
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	IRFB4110PBF	IRFB4227PBF
Series	HEXFET®	HEXFET®
Part Status	Active	Active
FET Type	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	100 V	200 V
Current - Continuous Drain(Id) @ 25°C	120A (Tc)	65A (Tc)
Drive Voltage(Max Rds On Min Rds On)	10V	10V
Rds On(Max) @ Id Vgs	4.5mOhm @ 75A, 10V	24mOhm @ 46A, 10V
Vgs(th)(Max) @ Id	4V @ 250µA	5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	210 nC @ 10 V	98 nC @ 10 V
Vgs(Max)	±20V	±30V
Input Capacitance(Ciss)(Max) @ Vds	9620 pF @ 50 V	4600 pF @ 25 V
Power Dissipation (Max)	370W (Tc)	330W (Tc)
Operating Temperature	-55°C ~ 175°C (TJ)	-40°C ~ 175°C (TJ)
Mounting Type	Through Hole	Through Hole

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