LPC1768FBD100 vs LPC1788FBD208K

This in-depth comparison of the LPC1768FBD100 and LPC1788FBD208K provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

LPC1768FBD100

NXP USA Inc.

Lifecycle
Active
Stock
1582 PCS
Package
SOT407-1
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

LPC1788FBD208K

NXP USA Inc.

Lifecycle
Active
Stock
5633 PCS
Package
SOT459-1
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification LPC1768FBD100 LPC1788FBD208K
Series LPC17xx LPC17xx
Part Status Active Active
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit Single-Core
Speed 100MHz 120MHz
Connectivity CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O 70 165
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
RAM Size 64K x 8 96K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V 2.4V ~ 3.6V
Data Converters A/D 8x12bSAR; D/A 1x10b A/D 8x12b; D/A 1x10b
Oscillator Type External, Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size - 4K x 8
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