LPC2132FBD64/01 vs LPC2129FBD64,151

This in-depth comparison of the LPC2132FBD64/01 and LPC2129FBD64,151 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

LPC2132FBD64/01

NXP USA Inc.

Lifecycle
Active
Stock
4389 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

LPC2129FBD64,151

NXP USA Inc.

Lifecycle
Active
Stock
8870 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification LPC2132FBD64/01 LPC2129FBD64,151
Supplier - NXP USA Inc.
Series LPC2100 LPC2100
Part Status Active Obsolete
Core Processor ARM7® ARM7®
Core Size 16/32-Bit 16/32-Bit
Speed 60MHz 60MHz
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT POR, PWM, WDT
Number of I/O 47 46
Program Memory Size 64KB (64K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.65V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b A/D 4x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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