LPC2136FBD64/01EL vs LPC2102FBD48,151 Comparison

This in-depth comparison of the LPC2136FBD64/01EL and LPC2102FBD48,151 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
LPC2136FBD64/01EL

+BOM

6419 PCS | NXP USA Inc.
LPC2102FBD48,151

+BOM

8124 PCS | NXP USA Inc.
Package SOT314-2 LQFP-48
Description IC MCU 16/32B 256KB FLASH 64LQFP IC MCU 16/32BIT 16KB FLSH 48LQFP
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series LPC2100 LPC2100
Part Status Active Not For New Designs
Core Processor ARM7® ARM7®
Core Size 16/32-Bit 16/32-Bit
Speed 60MHz 70MHz
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT POR, PWM, WDT
Number of I/O 47 32
Program Memory Size 256KB (256K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
RAM Size 32K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.65V ~ 3.6V
Data Converters A/D 16x10b SAR; D/A 1x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : LPC2136FBD64/01EL LPC2102FBD48,151

+BOM RFQ