M29F400FB55M3F2 vs M29F400FB55M3E2

This in-depth comparison of the M29F400FB55M3F2 and M29F400FB55M3E2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

M29F400FB55M3F2

Alliance Memory, Inc.

Lifecycle: Active
Stock: 2861 PCS
Package: SOIC-44
Series: Memory

+BOM RFQ

Part B

M29F400FB55M3E2

Micron Technology Inc.

Lifecycle: Active
Stock: 8040 PCS
Package: SOIC-44
Series: Memory

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	M29F400FB55M3F2	M29F400FB55M3E2
Part Status	Active	Obsolete
Memory Type	Non-Volatile	Non-Volatile
Memory Format	FLASH	FLASH
Technology	FLASH - NOR	FLASH - NOR
Memory Size	4Mb (512K x 8, 256K x 16)	4Mb (512K x 8, 256K x 16)
Memory Interface	-	Parallel
Write Cycle Time - Word Page	55ns	55ns
Access Time	55 ns	55 ns
Voltage - Supply	4.5V ~ 5.5V	4.5V ~ 5.5V
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount	Surface Mount
Series	Automotive, AEC-Q100	-

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