M30626FHPFP vs M30620FCPGP#35C

This in-depth comparison of the M30626FHPFP and M30620FCPGP#35C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

M30626FHPFP

Renesas Electronics America Inc

Lifecycle
Active
Stock
3611 PCS
Package
BQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

M30620FCPGP#35C

Renesas Electronics America Inc

Lifecycle
Active
Stock
2268 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification M30626FHPFP M30620FCPGP#35C
Supplier Renesas Electronics America Inc Renesas Electronics America Inc
Series M16C™ M16C/60/62P M16C™ M16C/60/62P
Part Status Last Time Buy Active
Core Processor M16C/60 M16C/60
Core Size 16-Bit 16-Bit
Speed 24MHz 24MHz
Connectivity I²C, IEBus, UART/USART I²C, IEBus, UART/USART
Peripherals DMA, WDT DMA, WDT
Number of I/O 87 87
Program Memory Size 384KB (384K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 4K x 8 4K x 8
RAM Size 31K x 8 10K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 26x10b; D/A 2x8b A/D 26x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 85°C (TA) -20°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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