MC33172DG vs MC33143DW

This in-depth comparison of the MC33172DG and MC33143DW provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC33172DG

onsemi

Lifecycle
Active
Stock
3470 PCS
Series
Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
+BOM RFQ
Part B

MC33143DW

NXP USA Inc.

Lifecycle
Active
Stock
2300 PCS
Package
SOIC-24
Series
PMIC - Power Distribution Switches, Load Drivers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC33172DG MC33143DW
Part Status Obsolete Obsolete
Switch Type - General Purpose
Number of Outputs - 2
Ratio - Input: Output - 1:1
Output Configuration - High Side
Output Type - N-Channel
Interface - On/Off
Voltage - Load - 9V ~ 17V
Voltage - Supply (Vcc/Vdd) - 4.5V ~ 5.5V
Rds On (Typ) - 140mOhm
Input Type - Non-Inverting
Fault Protection - Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature -40°C ~ 85°C -40°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Amplifier Type General Purpose -
Number of Circuits 2 -
Slew Rate 2.1V/µs -
Gain Bandwidth Product 1.8 MHz -
Current - Input Bias 20 nA -
Voltage - Input Offset 2 mV -
Supply Current 220µA (x2 Channels) -
Current - Output / Channel 27 mA -
Voltage - Supply Span(Min) 3 V -
Voltage - Supply Span(Max) 44 V -
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