MC33664ATL1EG vs MC33662BLEF

This in-depth comparison of the MC33664ATL1EG and MC33662BLEF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MC33664ATL1EG

Freescale Semiconductor

Lifecycle
Active
Stock
4768 PCS
Package
SOP-16
Series
PMIC - Power Management - Specialized
+BOM RFQ
Part B

MC33662BLEF

NXP USA Inc.

Lifecycle
Active
Stock
2593 PCS
Package
SOIC-8
Series
Interface - Drivers, Receivers, Transceivers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC33664ATL1EG MC33662BLEF
Supplier - NXP USA Inc.
Part Status Active Discontinued at Digi-Key
Type - Transceiver
Protocol - LINbus
Number of Drivers/Receivers - 1/1
Data Rate - 20kbps
Voltage - Supply 4.5V ~ 5.5V 7V ~ 18V
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount
Applications Isolated Communications Interface -
Supply Current 40mA -
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