MC33897CTEFR2 vs MC33883DWR2

This in-depth comparison of the MC33897CTEFR2 and MC33883DWR2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC33897CTEFR2

Freescale Semiconductor

Lifecycle: Active
Stock: 6013 PCS
Package: SOIC-14
Series: Interface - Drivers, Receivers, Transceivers

+BOM RFQ

Part B

MC33883DWR2

NXP USA Inc.

Lifecycle: Active
Stock: 2110 PCS
Package: SOIC-20
Series: PMIC - Gate Drivers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC33897CTEFR2	MC33883DWR2
Part Status	Active	Obsolete
Driven Configuration	-	Half-Bridge
Channel Type	-	Independent
Number of Drivers	-	4
Gate Type	-	N-Channel MOSFET
Voltage - Supply	12V	5.5V ~ 28V
Logic Voltage - VILVIH	-	0.8V, 2V
Current - Peak Output(Source Sink)	-	1A, 1A
Input Type	-	Non-Inverting
High Side Voltage - Max(Bootstrap)	-	55 V
Rise / Fall Time(Typ)	-	80ns, 80ns
Operating Temperature	-40°C ~ 125°C	-40°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount
Type	Transceiver	-
Protocol	CANbus	-
Number of Drivers/Receivers	1/1	-
Duplex	Half	-
Receiver Hysteresis	500 mV	-
Data Rate	83.33Kbps	-

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