MC33897CTEFR2 vs MC33883HEGR2 Comparison

This in-depth comparison of the MC33883HEGR2 and MC33897CTEFR2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC33883HEGR2

+BOM

4912 PCS | NXP USA Inc.
MC33897CTEFR2

+BOM

6013 PCS | Freescale Semiconductor
Package SOIC-20 SOIC-14
Description FULL BRIDGE BASED MOSFET DRIVER INTERFACE CIRCUIT, 1-TRNSVR, PDS
Series Bulk -
Driven Configuration Active -
Part Status - Active
Type - Transceiver
Protocol - CANbus
Number of Drivers/Receivers - 1/1
Duplex - Half
Receiver Hysteresis - 500 mV
Data Rate - 83.33Kbps
Voltage - Supply - 12V
Operating Temperature - -40°C ~ 125°C
Mounting Type - Surface Mount
Comparison Model : MC33883HEGR2 MC33897CTEFR2

+BOM RFQ