MC33PF8200DBES vs MC33PF8200DEES

This in-depth comparison of the MC33PF8200DBES and MC33PF8200DEES provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC33PF8200DBES

NXP USA Inc.

Lifecycle
Active
Stock
1496 PCS
Package
QFN-56
Series
PMIC - Power Management - Specialized
+BOM RFQ
Part B

MC33PF8200DEES

NXP USA Inc.

Lifecycle
Active
Stock
6399 PCS
Package
QFN-56
Series
PMIC - Power Management - Specialized
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC33PF8200DBES MC33PF8200DEES
Part Status Active Active
Applications High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank
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