MC34151DR2G vs MC34129EF

This in-depth comparison of the MC34151DR2G and MC34129EF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC34151DR2G

onsemi

Lifecycle: Active
Stock: 1538 PCS
Package: SOIC-8
Series: PMIC - Gate Drivers

+BOM RFQ

Part B

MC34129EF

NXP USA Inc.

Lifecycle: Active
Stock: 7432 PCS
Package: SOIC-14
Series: PMIC - Power Management - Specialized

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC34151DR2G	MC34129EF
Part Status	Active	Obsolete
Applications	-	Telecommunications
Supply Current	-	2.5mA
Voltage - Supply	6.5V ~ 18V	4V ~ 12V
Operating Temperature	0°C ~ 150°C (TJ)	0°C ~ 70°C
Mounting Type	Surface Mount	Surface Mount
Driven Configuration	Low-Side	-
Channel Type	Independent	-
Number of Drivers	2	-
Gate Type	N-Channel MOSFET	-
Logic Voltage - VILVIH	0.8V, 2.6V	-
Current - Peak Output(Source Sink)	1.5A, 1.5A	-
Input Type	Inverting	-
Rise / Fall Time(Typ)	31ns, 32ns	-

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