MC56F8013VFAE vs MC56F8367VVFE Comparison
This in-depth comparison of the MC56F8013VFAE and MC56F8367VVFE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
Package
SOT358-3
BGA-160
Description
IC MCU 16BIT 16KB FLASH 32LQFP
IC MCU 16B 512KB FLASH 160MAPBGA
Supplier
-
NXP USA Inc.
Series
56F8xxx
56F8xxx
Part Status
Active
Obsolete
Core Processor
56800E
56800E
Core Size
16-Bit
16-Bit
Speed
32MHz
60MHz
Connectivity
I²C, SCI, SPI
CANbus, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
POR, PWM, Temp Sensor, WDT
Number of I/O
26
76
Program Memory Size
16KB (8K x 16)
512KB (256K x 16)
Program Memory Type
FLASH
FLASH
RAM Size
2K x 16
18K x 16
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
2.25V ~ 3.6V
Data Converters
A/D 6x12b
A/D 16x12b
Oscillator Type
Internal
External
Operating Temperature
-40°C ~ 105°C (TA)
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Surface Mount
