MC56F8014VFAE vs MC56F8366MFVE

This in-depth comparison of the MC56F8014VFAE and MC56F8366MFVE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC56F8014VFAE

NXP USA Inc.

Lifecycle
Active
Stock
6249 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC56F8366MFVE

NXP USA Inc.

Lifecycle
Active
Stock
6412 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC56F8014VFAE MC56F8366MFVE
Supplier - Flip Electronics,NXP USA Inc.
Series 56F8xxx 56F8xxx
Part Status Active Active
Core Processor 56800E 56800E
Core Size 16-Bit 16-Bit
Speed 32MHz 60MHz
Connectivity I²C, SCI, SPI CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 26 62
Program Memory Size 16KB (8K x 16) 512KB (256K x 16)
Program Memory Type FLASH FLASH
RAM Size 2K x 16 18K x 16
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 2.25V ~ 3.6V
Data Converters A/D 8x12b A/D 16x12b
Oscillator Type Internal External
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
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