MC56F84763VLH vs MC56F8323MFBE

This in-depth comparison of the MC56F84763VLH and MC56F8323MFBE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MC56F84763VLH

NXP USA Inc.

Lifecycle
Active
Stock
8023 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC56F8323MFBE

NXP USA Inc.

Lifecycle
Active
Stock
7455 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC56F84763VLH MC56F8323MFBE
Series 56F8xxx 56F8xxx
Part Status Active Not For New Designs
Base Product Number MC56F84 -
Digi Key Programmable Not Verified -
Core Processor 56800EX 56800E
Core Size 32-Bit 16-Bit
Speed 100MHz 60MHz
Connectivity CANbus, I2C, LINbus, SCI, SPI CANbus, SCI, SPI
Peripherals Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 54 27
Program Memory Size 128KB (128K x 8) 32KB (16K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 2K x 8 -
RAM Size 24K x 8 12K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 2.25V ~ 3.6V
Data Converters A/D 16x12b, 8x16b; D/A 1x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Packaging Tray -
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