MC56F8323VFBE vs MC56F8367MPYE Comparison

This in-depth comparison of the MC56F8367MPYE and MC56F8323VFBE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC56F8367MPYE

+BOM

2570 PCS | NXP USA Inc.
MC56F8323VFBE

+BOM

4882 PCS | NXP USA Inc.
Package LQFP-160 LQFP-64
Description IC MCU 16BIT 512KB FLASH 160LQFP IC MCU 16BIT 32KB FLASH 64LQFP
Series 56F8xxx 56F8xxx
Part Status Active Not For New Designs
Core Processor 56800E 56800E
Core Size 16-Bit 16-Bit
Speed 60MHz 60MHz
Connectivity CANbus, EBI/EMI, SCI, SPI CANbus, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 76 27
Program Memory Size 512KB (256K x 16) 32KB (16K x 16)
Program Memory Type FLASH FLASH
RAM Size 18K x 16 12K x 8
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 2.25V ~ 3.6V
Data Converters A/D 16x12b A/D 8x12b
Oscillator Type External Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : MC56F8367MPYE MC56F8323VFBE

+BOM RFQ