MC56F8323VFBE vs MC56F84587VLL

This in-depth comparison of the MC56F8323VFBE and MC56F84587VLL provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC56F8323VFBE

NXP USA Inc.

Lifecycle
Active
Stock
4882 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC56F84587VLL

NXP USA Inc.

Lifecycle
Active
Stock
4310 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC56F8323VFBE MC56F84587VLL
Supplier - NXP USA Inc.
Series 56F8xxx 56F8xxx
Part Status Not For New Designs Active
Core Processor 56800E 56800EX
Core Size 16-Bit 32-Bit Single-Core
Speed 60MHz 80MHz
Connectivity CANbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O 27 86
Program Memory Size 32KB (16K x 16) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 2K x 8
RAM Size 12K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 16x12b, 16x16b; D/A 1x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
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