MC56F8355VFGE vs MC56F8014MFAE

This in-depth comparison of the MC56F8355VFGE and MC56F8014MFAE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC56F8355VFGE

Freescale Semiconductor

Lifecycle
Active
Stock
5258 PCS
Package
LQFP-128
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC56F8014MFAE

NXP USA Inc.

Lifecycle
Active
Stock
7177 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC56F8355VFGE MC56F8014MFAE
Supplier - NXP USA Inc.
Series 56F8xxx 56F8xxx
Part Status Active Active
Core Processor 56800E 56800E
Core Size 16-Bit 16-Bit
Speed 60MHz 32MHz
Connectivity CANbus, EBI/EMI, SCI, SPI I²C, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, WDT
Number of I/O 49 26
Program Memory Size 256KB (128K x 16) 16KB (8K x 16)
Program Memory Type FLASH FLASH
RAM Size 10K x 16 2K x 16
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 16x12b A/D 8x12b
Oscillator Type External Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
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