MC56F8366VFVE vs MC56F8023VLC

This in-depth comparison of the MC56F8366VFVE and MC56F8023VLC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC56F8366VFVE

NXP USA Inc.

Lifecycle
Active
Stock
4891 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC56F8023VLC

NXP USA Inc.

Lifecycle
Active
Stock
8028 PCS
Package
Surface Mount
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC56F8366VFVE MC56F8023VLC
Supplier - Rochester Electronics, LLC
Series 56F8xxx Bulk
Part Status Active 56F8xxx
Core Processor 56800E Active
Core Size 16-Bit 56800E
Speed 60MHz 16-Bit
Connectivity CANbus, EBI/EMI, SCI, SPI 32MHz
Peripherals POR, PWM, Temp Sensor, WDT I²C, LINbus, SCI, SPI
Number of I/O 62 POR, PWM, WDT
Program Memory Size 512KB (256K x 16) 26
Program Memory Type FLASH 32KB (16K x 16)
EEPROM Size - FLASH
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 2K x 16
Data Converters A/D 16x12b 3V ~ 3.6V
Oscillator Type External A/D 6x12b; D/A 2x12b
Operating Temperature -40°C ~ 105°C (TA) Internal
Mounting Type Surface Mount -40°C ~ 105°C (TA)
Base Product Number MC56F83 -
Digi Key Programmable Not Verified -
RAM Size 18K x 16 -
Packaging Tray -
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