MC68302FC16C vs MC68302CEH20C

This in-depth comparison of the MC68302FC16C and MC68302CEH20C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68302FC16C

NXP USA Inc.

Lifecycle
Active
Stock
1354 PCS
Package
PQFP-132
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68302CEH20C

Freescale Semiconductor

Lifecycle
Active
Stock
4346 PCS
Package
BQFP-132
Series
Embedded - Microprocessors
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68302FC16C MC68302CEH20C
Supplier - Rochester Electronics, LLC
Series M683xx M683xx
Part Status Obsolete Active
Core Processor M68000 M68000
Number of Cores / Bus Width 1 Core, 8/16-Bit 1 Core, 8/16-Bit
Speed 16MHz 20MHz
Co - Processors / DSP Communications; RISC CPM Communications; RISC CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Voltage - I / O 5.0V 5V
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Compare RFQ