MC68332ACEH20 vs MC68331CAG25

This in-depth comparison of the MC68332ACEH20 and MC68331CAG25 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC68332ACEH20

+BOM

6191 PCS | NXP USA Inc.
MC68331CAG25

+BOM

2132 PCS | NXP USA Inc.
Package SOT1695-1 LQFP-144
Description IC MCU 32BIT ROMLESS 132PQFP IC MCU 32BIT ROMLESS 144LQFP
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series M683xx M683xx
ProductStatus Not For New Designs Not For New Designs
CoreProcessor CPU32 CPU32
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 20MHz 25MHz
Connectivity EBI/EMI, SCI, SPI, UART/USART EBI/EMI, SCI, SPI, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
NumberofI/O 15 18
ProgramMemoryType ROMless ROMless
Voltage-Supply(Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
OscillatorType Internal Internal
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
RAMSize 2K x 8 -
Comparison Model : MC68332ACEH20 MC68331CAG25

+BOM RFQ