MC68332ACEH20 vs MC68331CAG25

This in-depth comparison of the MC68332ACEH20 and MC68331CAG25 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68332ACEH20

NXP USA Inc.

Lifecycle
Active
Stock
6191 PCS
Package
SOT1695-1
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC68331CAG25

NXP USA Inc.

Lifecycle
Active
Stock
2132 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68332ACEH20 MC68331CAG25
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series M683xx M683xx
Part Status Not For New Designs Not For New Designs
Core Processor CPU32 CPU32
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 20MHz 25MHz
Connectivity EBI/EMI, SCI, SPI, UART/USART EBI/EMI, SCI, SPI, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 15 18
Program Memory Type ROMless ROMless
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
RAM Size 2K x 8 -
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