MC68332ACEH25 vs MC68302EH20CB1

This in-depth comparison of the MC68332ACEH25 and MC68302EH20CB1 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68332ACEH25

NXP USA Inc.

Lifecycle
Active
Stock
2529 PCS
Package
PQFP-132
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC68302EH20CB1

NXP USA Inc.

Lifecycle
Active
Stock
6525 PCS
Package
BQFP-132
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68332ACEH25 MC68302EH20CB1
Supplier - NXP USA Inc.
Series M683xx M683xx
Part Status Not For New Designs Obsolete
Core Processor CPU32 M68000
Number of Cores / Bus Width - 1 Core, 8/16-Bit
Speed 25MHz 20MHz
Co - Processors / DSP - Communications; RISC CPM
RAM Controllers - DRAM
Graphics Acceleration - No
Voltage - I / O - 5.0V
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Core Size 32-Bit Single-Core -
Connectivity EBI/EMI, SCI, SPI, UART/USART -
Peripherals POR, PWM, WDT -
Number of I/O 15 -
Program Memory Type ROMless -
RAM Size 2K x 8 -
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V -
Oscillator Type Internal -
Mounting Type Surface Mount -
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