MC68332ACEH25 vs MC68376BGCAB20 Comparison

This in-depth comparison of the MC68332ACEH25 and MC68376BGCAB20 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC68332ACEH25

+BOM

2529 PCS | NXP USA Inc.
MC68376BGCAB20

+BOM

9996 PCS | NXP USA Inc.
Package PQFP-132 PQFP-160
Description IC MCU 32BIT ROMLESS 132PQFP IC MCU 32BIT ROMLESS 160QFP
Series M683xx M683xx
Part Status Not For New Designs Obsolete
Core Processor CPU32 CPU32
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 25MHz 20MHz
Connectivity EBI/EMI, SCI, SPI, UART/USART CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 15 18
Program Memory Type ROMless ROMless
RAM Size 2K x 8 7.5K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.75V ~ 5.25V
Data Converters - A/D 16x10b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : MC68332ACEH25 MC68376BGCAB20

+BOM RFQ