MC68340AG16E vs MC68332GVAG25

This in-depth comparison of the MC68340AG16E and MC68332GVAG25 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68340AG16E

NXP USA Inc.

Lifecycle
Active
Stock
3844 PCS
Package
LQFP-144
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68332GVAG25

NXP USA Inc.

Lifecycle
Active
Stock
8581 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68340AG16E MC68332GVAG25
Supplier - NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Not For New Designs
Core Processor CPU32 CPU32
Core Size - 32-Bit Single-Core
Speed 16MHz 25MHz
Connectivity - EBI/EMI, SCI, SPI, UART/USART
Peripherals - POR, PWM, WDT
Number of I/O - 15
Program Memory Type - ROMless
RAM Size - 2K x 8
Voltage - Supply (Vcc/Vdd) - 4.5V ~ 5.5V
Oscillator Type - Internal
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 105°C (TA)
Mounting Type - Surface Mount
Number of Cores / Bus Width 1 Core, 32-Bit -
RAM Controllers DRAM -
Graphics Acceleration No -
Voltage - I / O 5.0V -
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