MC68360AI25L vs MC68331CFC16B1

This in-depth comparison of the MC68360AI25L and MC68331CFC16B1 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68360AI25L

NXP USA Inc.

Lifecycle
Active
Stock
5112 PCS
Package
QFP-240
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68331CFC16B1

NXP USA Inc.

Lifecycle
Active
Stock
6559 PCS
Package
BQFP-132
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68360AI25L MC68331CFC16B1
Supplier - NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Obsolete
Core Processor CPU32+ CPU32
Core Size - 32-Bit Single-Core
Speed 25MHz 16MHz
Connectivity - EBI/EMI, SCI, SPI, UART/USART
Peripherals - POR, PWM, WDT
Number of I/O - 18
Program Memory Type - ROMless
Voltage - Supply (Vcc/Vdd) - 4.5V ~ 5.5V
Oscillator Type - Internal
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
Number of Cores / Bus Width 1 Core, 32-Bit -
Co - Processors / DSP Communications; CPM -
RAM Controllers DRAM -
Graphics Acceleration No -
Ethernet 10Mbps (1) -
Voltage - I / O 5.0V -
Compare RFQ