MC68360AI33L vs MC68302FC20C

This in-depth comparison of the MC68360AI33L and MC68302FC20C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68360AI33L

NXP USA Inc.

Lifecycle
Active
Stock
1979 PCS
Package
BFQFP-240
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68302FC20C

NXP USA Inc.

Lifecycle
Active
Stock
5821 PCS
Package
BQFP-132
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68360AI33L MC68302FC20C
Supplier - NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Obsolete
Core Processor CPU32+ M68000
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 8/16-Bit
Speed 33MHz 20MHz
Co - Processors / DSP Communications; CPM Communications; RISC CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Voltage - I / O 5.0V 5.0V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Ethernet 10Mbps (1) -
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