MC68360AI33L vs MC68331CEH25

This in-depth comparison of the MC68360AI33L and MC68331CEH25 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68360AI33L

NXP USA Inc.

Lifecycle
Active
Stock
1979 PCS
Package
BFQFP-240
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68331CEH25

NXP USA Inc.

Lifecycle
Active
Stock
4345 PCS
Package
BQFP-132
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68360AI33L MC68331CEH25
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Not For New Designs
Core Processor CPU32+ CPU32
Core Size - 32-Bit Single-Core
Speed 33MHz 25MHz
Connectivity - EBI/EMI, SCI, SPI, UART/USART
Peripherals - POR, PWM, WDT
Number of I/O - 18
Program Memory Type - ROMless
Voltage - Supply (Vcc/Vdd) - 4.5V ~ 5.5V
Oscillator Type - Internal
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
Number of Cores / Bus Width 1 Core, 32-Bit -
Co - Processors / DSP Communications; CPM -
RAM Controllers DRAM -
Graphics Acceleration No -
Ethernet 10Mbps (1) -
Voltage - I / O 5.0V -
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