MC68HC11F1CPU4 vs MC68HC908GR4CFA

This in-depth comparison of the MC68HC11F1CPU4 and MC68HC908GR4CFA provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68HC11F1CPU4

NXP USA Inc.

Lifecycle
Active
Stock
5163 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC68HC908GR4CFA

NXP USA Inc.

Lifecycle
Active
Stock
3270 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68HC11F1CPU4 MC68HC908GR4CFA
Supplier - NXP USA Inc.
Series HC11 HC08
Part Status Obsolete Obsolete
Core Processor HC11 HC08
Core Size 8-Bit 8-Bit
Speed 4MHz 8MHz
Connectivity SCI, SPI SCI, SPI
Peripherals POR, WDT LVD, POR, PWM
Number of I/O 30 21
Program Memory Size - 4KB (4K x 8)
Program Memory Type ROMless FLASH
RAM Size 1K x 8 384 x 8
Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V 2.7V ~ 5.5V
Data Converters A/D 8x8b A/D 6x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Base Product Number MC68HC11 -
Digi Key Programmable Verified -
EEPROM Size 512 x 8 -
Packaging Tray -
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