MC68HC705C8ACP vs MC68HC705SR3CPE

This in-depth comparison of the MC68HC705C8ACP and MC68HC705SR3CPE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MC68HC705C8ACP

NXP USA Inc.

Lifecycle
Active
Stock
1420 PCS
Package
PDIP-40
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC68HC705SR3CPE

NXP USA Inc.

Lifecycle
Active
Stock
5737 PCS
Package
DIP-40
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68HC705C8ACP MC68HC705SR3CPE
Supplier - NXP USA Inc.
Series HC05 HC05
Part Status Obsolete Obsolete
Core Processor HC05 HC05
Core Size 8-Bit 8-Bit
Speed 2.1MHz 4MHz
Peripherals POR, WDT LED, POR
Number of I/O 24 32
Program Memory Size 8KB (8K x 8) 3.75KB (3.75K x 8)
Program Memory Type OTP OTP
RAM Size 304 x 8 192 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters - A/D 4x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Through Hole Through Hole
Connectivity SCI, SPI -
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