MC908AB32CFUE vs MC908AP64ACFBE

This in-depth comparison of the MC908AB32CFUE and MC908AP64ACFBE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908AB32CFUE

NXP USA Inc.

Lifecycle
Active
Stock
7018 PCS
Package
PQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908AP64ACFBE

NXP USA Inc.

Lifecycle
Active
Stock
9947 PCS
Package
QFP-44
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908AB32CFUE MC908AP64ACFBE
Supplier - Flip Electronics,NXP USA Inc.
Series HC08 HC08
Part Status Not For New Designs Not For New Designs
Core Processor HC08 HC08
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity SCI, SPI I²C, IRSCI, SCI, SPI
Peripherals POR, PWM LED, LVD, POR, PWM
Number of I/O 51 32
Program Memory Size 32KB (32K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
RAM Size 1K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 8x8b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size 512 x 8 -
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