MC908AP32CFAE vs MC908GZ60CFAE

This in-depth comparison of the MC908AP32CFAE and MC908GZ60CFAE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908AP32CFAE

NXP USA Inc.

Lifecycle
Active
Stock
3697 PCS
Package
LQFP-48
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908GZ60CFAE

NXP USA Inc.

Lifecycle
Active
Stock
9246 PCS
Package
LQFP-48
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908AP32CFAE MC908GZ60CFAE
Supplier NXP USA Inc. Flip Electronics
Series HC08 HC08
Part Status Not For New Designs Not For New Designs
Core Processor HC08 M68HC08
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity I²C, IRSCI, SCI, SPI CANbus, LINbus, SCI, SPI
Peripherals LED, LVD, POR, PWM LVD, POR, PWM
Number of I/O 32 37
Program Memory Size 32KB (32K x 8) 60KB (60K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 8x10b A/D 24x10b SAR
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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