MC908AP64CFBE vs MC908GR32AMFUE

This in-depth comparison of the MC908AP64CFBE and MC908GR32AMFUE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908AP64CFBE

NXP USA Inc.

Lifecycle
Active
Stock
5681 PCS
Package
PQFP-44
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908GR32AMFUE

NXP USA Inc.

Lifecycle
Active
Stock
5950 PCS
Package
QFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908AP64CFBE MC908GR32AMFUE
Supplier - NXP USA Inc.
Series - HC08
Part Status Active Not For New Designs
Core Processor - HC08
Core Size - 8-Bit
Speed - 8MHz
Connectivity - SCI, SPI
Peripherals - LVD, POR, PWM
Number of I/O - 53
Program Memory Size - 32KB (32K x 8)
Program Memory Type - FLASH
RAM Size - 1.5K x 8
Voltage - Supply (Vcc/Vdd) - 3V ~ 5.5V
Data Converters - A/D 24x10b
Oscillator Type - Internal
Operating Temperature - -40°C ~ 125°C (TA)
Mounting Type - Surface Mount
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