MC908AZ60ACFU vs MC908AP32ACFBE

This in-depth comparison of the MC908AZ60ACFU and MC908AP32ACFBE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908AZ60ACFU

NXP USA Inc.

Lifecycle
Active
Stock
6728 PCS
Package
QFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908AP32ACFBE

NXP USA Inc.

Lifecycle
Active
Stock
480 PCS
Package
QFP-44
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908AZ60ACFU MC908AP32ACFBE
Supplier - Flip Electronics,NXP USA Inc.
Series HC08 HC08
Part Status Obsolete Not For New Designs
Core Processor HC08 HC08
Core Size 8-Bit 8-Bit
Speed 8.4MHz 8MHz
Connectivity CANbus, SCI, SPI I²C, IRSCI, SCI, SPI
Peripherals LVD, POR, PWM LED, LVD, POR, PWM
Number of I/O 52 32
Program Memory Size 60KB (60K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 15x8b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
EEPROM Size 1K x 8 -
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