MC908JL3ECDWE vs MC908GR8AMDWE Comparison

This in-depth comparison of the MC908JL3ECDWE and MC908GR8AMDWE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC908JL3ECDWE

+BOM

1612 PCS | Freescale Semiconductor
MC908GR8AMDWE

+BOM

2639 PCS | NXP USA Inc.
Package SOIC-28 SOIC-28
Description IC MCU 8BIT 4KB FLASH 28SOIC IC MCU 8BIT 7.5KB FLASH 28SOIC
Supplier - NXP USA Inc.
Series HC08 HC08
Part Status Active Obsolete
Core Processor HC08 HC08
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SCI, SPI
Peripherals LED, LVD, POR, PWM LVD, POR, PWM
Number of I/O 23 17
Program Memory Size 4KB (4K x 8) 7.5KB (7.5K x 8)
Program Memory Type FLASH FLASH
RAM Size 128 x 8 384 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V 2.7V ~ 5.5V
Data Converters A/D 12x8b A/D 6x8b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : MC908JL3ECDWE MC908GR8AMDWE

+BOM RFQ