MC9S08FL16CBM vs MC9S08QE4CPG

This in-depth comparison of the MC9S08FL16CBM and MC9S08QE4CPG provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08FL16CBM

NXP USA Inc.

Lifecycle
Active
Stock
4359 PCS
Package
SDIP-32
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08QE4CPG

NXP USA Inc.

Lifecycle
Active
Stock
5526 PCS
Package
DIP-16
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08FL16CBM MC9S08QE4CPG
Supplier - NXP USA Inc.
Series S08 S08
Part Status Obsolete Obsolete
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Connectivity SCI I²C, LINbus, SCI, SPI
Peripherals LVD, PWM, WDT LVD, PWM, WDT
Number of I/O 30 12
Program Memory Size 16KB (16K x 8) 4KB (4K x 8)
Program Memory Type FLASH FLASH
RAM Size 1K x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 1.8V ~ 3.6V
Data Converters A/D 12x8b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Through Hole Through Hole
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