MC9S08AC16CFGE vs MC9S08FL8CLC

This in-depth comparison of the MC9S08AC16CFGE and MC9S08FL8CLC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08AC16CFGE

NXP USA Inc.

Lifecycle: Active
Stock: 4363 PCS
Package: LQFP-44
Series: Embedded - Microcontrollers

+BOM RFQ

Part B

MC9S08FL8CLC

NXP USA Inc.

Lifecycle: Active
Stock: 2401 PCS
Package: LQFP-32
Series: Embedded - Microcontrollers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC9S08AC16CFGE	MC9S08FL8CLC
Series	S08	S08
Part Status	Active	Active
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	20MHz
Connectivity	I²C, SCI, SPI	SCI
Peripherals	LVD, POR, PWM, WDT	LVD, PWM, WDT
Number of I/O	34	30
Program Memory Size	16KB (16K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
RAM Size	1K x 8	768 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	4.5V ~ 5.5V
Data Converters	A/D 8x10b	A/D 12x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount

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