MC9S08FL8CLC vs MC9S08DN32MLC Comparison

This in-depth comparison of the MC9S08FL8CLC and MC9S08DN32MLC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC9S08FL8CLC

+BOM

2401 PCS | NXP USA Inc.
MC9S08DN32MLC

+BOM

3269 PCS | NXP USA Inc.
Package LQFP-32 LQFP-32
Description IC MCU 8BIT 8KB FLASH 32LQFP IC MCU 8BIT 32KB FLASH 32LQFP
Supplier - NXP USA Inc.
Series S08 S08
Part Status Active Obsolete
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 20MHz 40MHz
Connectivity SCI I²C, LINbus, SCI, SPI
Peripherals LVD, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 30 25
Program Memory Size 8KB (8K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 1K x 8
RAM Size 768 x 8 1.5K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x8b A/D 10x12b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : MC9S08FL8CLC MC9S08DN32MLC

+BOM RFQ