MC9S08JM60CLD vs MC9S08PL8CLC

This in-depth comparison of the MC9S08JM60CLD and MC9S08PL8CLC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MC9S08JM60CLD

Freescale Semiconductor

Lifecycle
Active
Stock
2366 PCS
Package
LQFP-44
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08PL8CLC

NXP USA Inc.

Lifecycle
Active
Stock
2443 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08JM60CLD MC9S08PL8CLC
Supplier - NXP USA Inc.
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 48MHz 20MHz
Connectivity I²C, LINbus, SCI, SPI, USB LINbus, SCI, UART/USART
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM
Number of I/O 33 30
Program Memory Size 60KB (60K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 256 x 8
RAM Size 4K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 8x12b A/D 12x10b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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