MC9S08QD4CSC vs MC9S08EL16CTL

This in-depth comparison of the MC9S08QD4CSC and MC9S08EL16CTL provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08QD4CSC

Freescale Semiconductor

Lifecycle
Active
Stock
5885 PCS
Package
SOIC-8
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08EL16CTL

NXP Semiconductors

Lifecycle
Active
Stock
6820 PCS
Package
TSSOP-28
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08QD4CSC MC9S08EL16CTL
Supplier - Rochester Electronics, LLC
Part Status Active Obsolete
Core Processor - HCS08
Core Size - 8-Bit
Speed - 40MHz
Connectivity - I²C, LINbus, SCI, SPI
Peripherals - LVD, POR, PWM, WDT
Number of I/O - 22
Program Memory Size - 16KB (16K x 8)
Program Memory Type - FLASH
EEPROM Size - 512 x 8
RAM Size - 1K x 8
Voltage - Supply (Vcc/Vdd) - 2.7V ~ 5.5V
Data Converters - A/D 16x10b SAR
Oscillator Type - External, Internal
Operating Temperature - -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
Compare RFQ